PCB Fabrication Specs

Standard PCB Fabrication Specs

 
Item Manufacturing Capabilities Remarks
Number of Layers 1-10 layers PCBs with greater than 10 layers are considered advanced specs.
Material FR-4, Flex, Rigid-flex, Metal-based (Aluminum etc), HDI, Halogen-free, High Tg, 370HR Please contact us if you require more advanced materials such as ceramic or rogers.
Maximum PCB Size (Dimension) 500mm x 1100mm Please contact us if you need help sourcing a larger panel.
Board routing / v-cut tolerance ±0.2mm/±0.5mm ±0.2mm for CNC routing, and ±0.5mm for V-scoring.
Board Thickness 0.2-2.4mm 0.2, 0.4, 0.6, 0.8, 1.0, 1.2, 1.6, 2.0, 2.4mm. Please contact us if your board exceeds these specs.
Min Trace 0.1mm/4mil Min manufacturable trace is 4mil (0.1mm) Tip: Use 6mil(0.15mm) to save cost.
Min Spacing Min manufacturable spacing is 4mil(0.1mm) Tip: Use 6mil(0.15mm) to save cost.
Copper weight 1oz/2oz/3oz(35μm/70μm/105μm) Please contact us if you need copper weight greater than 3oz.
Inner Layer Copper Thickness 0.5oz/1oz/1.5oz(35μm/50μm) Please contact us if you need copper thickness greater than 1.5oz.
Drill Sizes (CNC) 0.2-6.3mm Min drill size is 0.2mm, max drill is 6.3mm. Any holes greater than 6.3mm or smaller than 0.3mm may be extra cost.
Min Width of Annular Ring 0.15mm(6mil) Via in pads: Min annular ring is 0.15mm(6mil).
Finished Hole Diameter (CNC) 0.2mm-6.2mm Copper plating reduces the diameter.
Finished Hole Size Tolerance(CNC) ±0.08mm
Solder Mask LPI Contact us if you require a different material.
Minimum Silkscreen Line Width 0.15mm Lines less than 0.15mm wide may be unidentifiable.
Minimum Silkscreen Character Height 0.8mm Characters of less than 0.8mm high may be unidentifiable.
Character Silkscreen Width to Height Ratio 1:5 1:5 is standard.
Minimum Diameter of Castellated Holes 0.6mm Use a diameter greater than 0.6mm to ensure a better connection between boards.
Surface Finishing HASL with lead
HASL lead free
ENIG
Immersion gold, OSP		 These are the most popular PCB surface finishes. Contact us if you require other finishes.
Solder Mask Green, Red, Yellow, Blue, White ,Black, Matte Black No extra charge for Green, Red, Yellow, Blue
Silkscreen White, Black, None No extra charge.
Panelization V-scoring
Tab-routing		 In most cases, Henway engineers will panelize your design. However, if you choose to panelize, leave min clearance of 1.6mm between boards for break-routing. For V-score panelization, set the space between boards to be zero.
Others Fly Probe Testing (Free) and A.O.I. testing, programming/power on testing, test fixture design. We are a full service PCB assembly and custom electronics design house. Please don’t hesitate to contact us should you need any help with electronics design, testing, or sourcing!
 
 

Detailed PCB Fabrication Specs

 
Item Standard Medium Difficulty Requires Special Review
Multilayer PCB Layers 3L≤Layers≤16L 18L≤Layers≤24L ≥24L
Blind and Buried Vias HDI(1+1+....+N+......+1+1) Any layer HDI HDI(2+...+N...+2)
Surface Coating HASL
Immersion gold
OSP
Immersion Tin
Local immersion gold Contact us if you require a different surface coating.
Electroless Nickel-Immersion Gold, ENIG plating thickness 100-150 µin nickel thickness
1-8 µin gold thickness		 200 µin nickel thickness
Full board gold plating 100-150 µin nickel thickness
1-10 µin gold thickness		 10-50 µin gold thickness 200-500 µin nickel thickness
Gold fingers 120-150 µin nickel thickness
1-30 µin gold thickness		 30-50 µin gold thickness 200-400 µin nickel thickness
Board material FR-4
Aluminum
Rogers4 series + FR-4 mixed
CEM-3
LianMao IT158/IT180A
370HR		 Pure ROGERS4 series multi-layer board
PTF
Aluminum+FR4
PTFE+FR4
Drill diameter 0.20mm ≤ Drill diameter ≤ 6.5mm > 6.0mm uses CNC milling

hole diameter 0.2mm, maximum board thickness 1.6mm

hole diameter diameter 0.25mm, maximum board thickness 2.0mm

hole diameter 0.3mm ≤Ф≤ 0.35mm, maximum board thickness 3.2mm

hole diameter 0.4mm ≤Ф≤ 0.55mm, maximum board thickness 4.8mm

hole diameter > 0.55mm, maximum board thickness 6.4mm		 6.5mm or more ±0.1mm ≤ hole diameter tolerance
Thickness to diameter ratio Thickness to diameter ratio ≤ 8 8 10
Countersink 3.0mm ≤ hole diamete r≤ 6.5mm
Beveling for gold finger tolerance (Bevel angle 20°30°45°60°) >±5° >±5° >±5°
Hole position tolerances ±0.075mm ±0.05mm
Via（≤0.45mm) hole to hole spacing ≥11mil
Component hole Hole to hole spacing ≥16mil 14≤Hole to hole spacing≤16
Slot width Plated slot ≥0.5mm
Non-plated slot ≥0.8mm
Castellated Holes diameter ≥0.5mm 0.5mm>diameter≥0.4mm
Castellated Holes spacing (edge to edge) ≥0.3mm 0.3mm>diameters≥0.2mm
Inner layer min trace/space copper thickness 18um ≥4/4 mil ≥4/3.5 mil <3.5/3 mil
Inner layer min trace/space copper thickness 35um ≥4/5 mil ≥4/4 mil <3.5/4 mil
Inner layer min trace/space copper thickness 70um ≥6/8mil ≥6/7mil <5/6 mil
Inner layer min trace/space copper thickness 105um ≥8/11 mil ≥8/10 mil <6/9 mil
Outer layer min trace/space copper thickness 18um ≥4/5 mil ≥4/4 mil or 3.5/3.5mil for BGAs <3.5/3.5 mil
Outer layer min trace/space copper thickness 35um ≥5/6 mil ≥5/5 mil <4/4 mil
Outer layer min trace/space copper thickness 70um ≥7/8mil ≥6/7mil <5/6 mil
Outer layer min trace/space copper thickness 105um ≥10/12 mil ≥8/10 mil <6/9 mil
BGA pad diameter diameter≥11mil 8.0mil≤diameter<11.0mil <6mil
Trace to board edge distance (CNC milling) 0.25mm 0.20mm <0.20mm
Green solder mask opening（mil） ≥2mil 1.5mil 1mil
Green solder mask Bridge（mil） 4mil 3-4mil
Solder mask plug hole diameter 0.20mm≤hole diameter≤0.40mm，plug hole fullness 70% 0.4mm< hole diameter ≤0.70mm fullness 100%
Impedance control tolerance ±10%，50Ω and below：±5Ω
Bow and Twist Tolerance bow and twist≤0.75% 0.75%≤bow and twist≤0.5% bow and twist<0.5%
Acceptance Criteria IPC Level 2 standard IPC Level 3 standard