PCB Backdrill
What is a backdrill?
Who cares about it and why should I care about it?
What decision should I take?
Backdrilling is a technique used by high speed PCB designers to remove the unused part of a plated-through-hole (vias) so the via acts less like an antenna. Stubs can cause reflections and impedance problems in high speed digital PCB design and backdrilling is one method to control them.
General Characteristics
Mostly performed on rigid PCBs with 8 or more layers
Board thickness is over 2.5mm
Minimum hold size is 0.3mm
Backdrill is 0.2mm larger than the vias
Tolerance of backdrill depth is +/-0.05MM
Advantages:
Less signal attenuation with improved impedance matching
Increased channel bandwidth
Increased data rates
Reduced EMI/EMC radiation
Reduced excitation of resonance modes
Reduced via-to-via crosstalk
Reduced deterministic jitter
Lower bit error rate (BER)