HDI PCB

 
 

What is an HDI PCB?

HDI PCB.jpg

High density interconnects (HDI) PCBs are more advanced than traditional FR4 PCBs. The HDI PCB design can accommodate thinner vias and smaller vias landing pads, as well as larger connection pad densities. HDI boards are necessary if you have blind and buried vias or micro vias with a diameter of 0.006” or less. 

Designers can now insert more components on both sides of the bare PCB. More components closer together means faster digital data transmissions and significant reduction in signal loss and signal crossing delays.  Mobile phones, medical equipment, laptop computers, digital cameras, and 4G-5G network communications are all examples of where HDI PCBs are prevalent. Usually FPGA or BGA with 1mm or less spacing require HDI technology.


Function improved by HDI PCB:

  1. Denser trace routing

  2. More stable power

  3. Reduce interference inductance and capacitance effects

  4. Improve signal integrity in high-speed design

  5. More component space (also by Via-in-Pad)


Typical HDI PCB manufacturing capabilities

  • Number of Layers: 4-30 layer

  • Quality Grade: IPC 6012 Class 2,IPC 6012 Class 3

  • Material: Tg 140°C FR4,Tg 150°C FR4,Tg 170°C FR4 ,Special material

  • Thickness: 0.4-6.0mm

  • Min Track/Spacing: 2-8mil

  • Min Hole Size: 0.15mm-0.3mm

  • Solder Mask: Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green

  • Silkscreen: White, Black,Yellow,Blue

  • Surface Finish: Immersion gold,OSP,Hard gold,Immersion Silver

  • Finished Copper: 0.5-13oz

  • Build time: 5-10 days