HDI PCB
What is an HDI PCB?
High density interconnects (HDI) PCBs are more advanced than traditional FR4 PCBs. The HDI PCB design can accommodate thinner vias and smaller vias landing pads, as well as larger connection pad densities. HDI boards are necessary if you have blind and buried vias or micro vias with a diameter of 0.006” or less.
Designers can now insert more components on both sides of the bare PCB. More components closer together means faster digital data transmissions and significant reduction in signal loss and signal crossing delays. Mobile phones, medical equipment, laptop computers, digital cameras, and 4G-5G network communications are all examples of where HDI PCBs are prevalent. Usually FPGA or BGA with 1mm or less spacing require HDI technology.
Function improved by HDI PCB:
Denser trace routing
More stable power
Reduce interference inductance and capacitance effects
Improve signal integrity in high-speed design
More component space (also by Via-in-Pad)
Typical HDI PCB manufacturing capabilities
Number of Layers: 4-30 layer
Quality Grade: IPC 6012 Class 2,IPC 6012 Class 3
Material: Tg 140°C FR4,Tg 150°C FR4,Tg 170°C FR4 ,Special material
Thickness: 0.4-6.0mm
Min Track/Spacing: 2-8mil
Min Hole Size: 0.15mm-0.3mm
Solder Mask: Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green
Silkscreen: White, Black,Yellow,Blue
Surface Finish: Immersion gold,OSP,Hard gold,Immersion Silver
Finished Copper: 0.5-13oz
Build time: 5-10 days